Enea and CEVA Announce Enea OSE ck Real-Time Operating System for CEVA-X and CEVA-TeakLite-III DSP Architectures
Stockholm, Sweden, and San Jose, Calif.,- June 4, 2008 – Enea (Nordic Exchange/Small Cap/ENEA), a world leading provider of network software and services and CEVA, Inc. (NASDAQ: CEVA); (LSE: CVA), a leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced the availability of the Enea OSE ck real-time operating system for two CEVA DSP architectures: the CEVA-TeakLite-III and the CEVA-X. These two low-power, high-performance DSP architectures, together with Enea OSE ck, provide an ideal platform for a broad range of multimedia and wireless baseband applications, including high-definition audio, portable media players, 3G and 4G mobile handsets and VoIP residential gateways.
"Today's converged multimedia consumer devices require an enormous amount of signal processing capability," said Terry Pearson, vice president of marketing at Enea. "But they also have severe cost and power constraints. The CEVA cores deliver unprecedented signal processing performance with low power consumption. Enea OSE ck's small footprint, nimble real-time response, and high-level programming environment makes it ideal for developing and deploying complex signal processing applications targeting CEVA's processors."
"Our CEVA-TeakLite-III and CEVA-X DSP architectures set a new standard for scalable, low-power, high-performance, signal processing," said Eyal Ben-Avraham, vice president, Strategic Accounts & Partners at CEVA. "Enea OSE ck provides a proven real-time architecture that has already shipped in millions of devices worldwide. Its small code size and memory footprint, coupled with its intuitive messaging architecture and support for high-level languages like C, make it an attractive platform for developing and hosting CEVA-based multimedia and baseband applications."
CEVA-TeakLite-III(TM) is a third-generation DSP architecture based on the broadly adopted TeakLite family of DSP cores. Featuring native 32-bit processing and a dual Multiply-Accumulate (MAC) architecture, CEVA-TeakLite-III cores are ideal for High Definition (HD) audio applications such as Dolby Digital Plus 7.1, Dolby TrueHD and DTS-HD. The cores are also ideal for cost-sensitive consumer products such as 2G/2.5G/3G wireless baseband modems, wideband voice and audio processors, portable media players, voice-over-IP residential gateways and dual mode cellular/voice-over-WiFi handsets.
CEVA-X is a scalable VLIW-SIMD DSP architecture that delivers high levels of performance with low power consumption. CEVA-X is a multipurpose architecture, supporting multiple derivative cores that can be optimized to meet the performance, price, and power requirements of specific applications such as 3G and 4G phones, Smartphones, Personal Media Players and infrastructure equipment. The CEVA-X architecture can be extended with user-defined instructions. It is also scalable, supporting from 2 to 16 MAC units with added computational resources and memory bandwidth.
Enea OSEck (OSE Compact Kernel) is a DSP-optimized version of Enea's full-featured OSE RTOS. Occupying as little as 8 kbytes of memory, OSE ck delivers fully-preemptive, event-driven real-time response and features built-in error detection and handling. This combination makes OSE ck ideal for telecom, datacom, automotive, industrial control, medical and mil/aero applications with tight memory constraints that require reliable real-time control and signal processing.
Like all members of the Enea OSE family, Enea OSEck employs a high-level message passing programming model that makes it easy to break complex applications into simpler concurrent processes, each communicating via high-speed direct messages. Enea LINX interprocess communications (IPC) services extend the benefits of message passing to Enea OSEck applications distributed across multiple DSPs. Enea OSE ck provides a simple yet powerful API, whose high level of abstraction typically enables programmers to code the bulk of their application with just eight system calls. This versatile API, together with OSE ck's high-level messaging protocol, reduces application size and complexity, and makes programs easier to maintain, read and understand.
About CEVA, Inc.
Headquartered in San Jose, Calif., CEVA is a leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores for mobile handsets, consumer electronics and storage applications. CEVA's IP portfolio includes comprehensive solutions for multimedia, audio, voice over packet (VoP), Bluetooth and Serial ATA (SATA), and a wide range of programmable DSP cores and subsystems with different price/performance metrics serving multiple markets. In 2007, CEVA's IP was shipped in over 225 million devices. For more information, visit www.ceva-dsp.com/